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Applied Biological Materials Inc abm series 60 exposure systems
( A ) TPE microfabrication process: (i) A silicon wafer with SU-8 patterns serves as a master for (ii) the negative PDMS mold, which is replicated once more in the form of (iii) the epoxy master mold. Hot embossing using the epoxy mold enables fabrication of (iv) TPE and PC/TPE-hybrid-based microfluidic platforms. ( B ) Micrographs of features fabricated by hot embossing into TPE and PC/TPE-hybrid as well as the used <t>photomask.</t> A close-up side view shows microstructures in the TPE part of a PC/TPE-hybrid. The full-sized side view image of the PC/TPE-hybrid, additionally showing the transition from TPE to PC, is presented in the . Scale bar represents 200 µm. Comparison of feature dimensions between different structures, materials, and the original CAD design. The features have a height of approximately 100 µm. ( C ) UV-VIS transmittance spectra of TPE, PC, and PC/TPE-hybrid as well as of an Ostemer Crystal clear disc and a PDMS slab for comparison purposes. The inset comprises a photograph of a PC/TPE-hybrid device (left) and a TPE device (right) demonstrating the difference in transparency.
Abm Series 60 Exposure Systems, supplied by Applied Biological Materials Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/abm+series+60+exposure+systems/pmc08158514-65-11-21?v=Applied+Biological+Materials+Inc
Average 90 stars, based on 1 article reviews
abm series 60 exposure systems - by Bioz Stars, 2026-07
90/100 stars

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1) Product Images from "Facile Patterning of Thermoplastic Elastomers and Robust Bonding to Glass and Thermoplastics for Microfluidic Cell Culture and Organ-on-Chip"

Article Title: Facile Patterning of Thermoplastic Elastomers and Robust Bonding to Glass and Thermoplastics for Microfluidic Cell Culture and Organ-on-Chip

Journal: Micromachines

doi: 10.3390/mi12050575

( A ) TPE microfabrication process: (i) A silicon wafer with SU-8 patterns serves as a master for (ii) the negative PDMS mold, which is replicated once more in the form of (iii) the epoxy master mold. Hot embossing using the epoxy mold enables fabrication of (iv) TPE and PC/TPE-hybrid-based microfluidic platforms. ( B ) Micrographs of features fabricated by hot embossing into TPE and PC/TPE-hybrid as well as the used photomask. A close-up side view shows microstructures in the TPE part of a PC/TPE-hybrid. The full-sized side view image of the PC/TPE-hybrid, additionally showing the transition from TPE to PC, is presented in the . Scale bar represents 200 µm. Comparison of feature dimensions between different structures, materials, and the original CAD design. The features have a height of approximately 100 µm. ( C ) UV-VIS transmittance spectra of TPE, PC, and PC/TPE-hybrid as well as of an Ostemer Crystal clear disc and a PDMS slab for comparison purposes. The inset comprises a photograph of a PC/TPE-hybrid device (left) and a TPE device (right) demonstrating the difference in transparency.
Figure Legend Snippet: ( A ) TPE microfabrication process: (i) A silicon wafer with SU-8 patterns serves as a master for (ii) the negative PDMS mold, which is replicated once more in the form of (iii) the epoxy master mold. Hot embossing using the epoxy mold enables fabrication of (iv) TPE and PC/TPE-hybrid-based microfluidic platforms. ( B ) Micrographs of features fabricated by hot embossing into TPE and PC/TPE-hybrid as well as the used photomask. A close-up side view shows microstructures in the TPE part of a PC/TPE-hybrid. The full-sized side view image of the PC/TPE-hybrid, additionally showing the transition from TPE to PC, is presented in the . Scale bar represents 200 µm. Comparison of feature dimensions between different structures, materials, and the original CAD design. The features have a height of approximately 100 µm. ( C ) UV-VIS transmittance spectra of TPE, PC, and PC/TPE-hybrid as well as of an Ostemer Crystal clear disc and a PDMS slab for comparison purposes. The inset comprises a photograph of a PC/TPE-hybrid device (left) and a TPE device (right) demonstrating the difference in transparency.

Techniques Used: Comparison



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Applied Biological Materials Inc abm series 60 exposure systems
( A ) TPE microfabrication process: (i) A silicon wafer with SU-8 patterns serves as a master for (ii) the negative PDMS mold, which is replicated once more in the form of (iii) the epoxy master mold. Hot embossing using the epoxy mold enables fabrication of (iv) TPE and PC/TPE-hybrid-based microfluidic platforms. ( B ) Micrographs of features fabricated by hot embossing into TPE and PC/TPE-hybrid as well as the used <t>photomask.</t> A close-up side view shows microstructures in the TPE part of a PC/TPE-hybrid. The full-sized side view image of the PC/TPE-hybrid, additionally showing the transition from TPE to PC, is presented in the . Scale bar represents 200 µm. Comparison of feature dimensions between different structures, materials, and the original CAD design. The features have a height of approximately 100 µm. ( C ) UV-VIS transmittance spectra of TPE, PC, and PC/TPE-hybrid as well as of an Ostemer Crystal clear disc and a PDMS slab for comparison purposes. The inset comprises a photograph of a PC/TPE-hybrid device (left) and a TPE device (right) demonstrating the difference in transparency.
Abm Series 60 Exposure Systems, supplied by Applied Biological Materials Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/abm+series+60+exposure+systems/pmc08158514-65-11-21?v=Applied+Biological+Materials+Inc
Average 90 stars, based on 1 article reviews
abm series 60 exposure systems - by Bioz Stars, 2026-07
90/100 stars
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( A ) TPE microfabrication process: (i) A silicon wafer with SU-8 patterns serves as a master for (ii) the negative PDMS mold, which is replicated once more in the form of (iii) the epoxy master mold. Hot embossing using the epoxy mold enables fabrication of (iv) TPE and PC/TPE-hybrid-based microfluidic platforms. ( B ) Micrographs of features fabricated by hot embossing into TPE and PC/TPE-hybrid as well as the used photomask. A close-up side view shows microstructures in the TPE part of a PC/TPE-hybrid. The full-sized side view image of the PC/TPE-hybrid, additionally showing the transition from TPE to PC, is presented in the . Scale bar represents 200 µm. Comparison of feature dimensions between different structures, materials, and the original CAD design. The features have a height of approximately 100 µm. ( C ) UV-VIS transmittance spectra of TPE, PC, and PC/TPE-hybrid as well as of an Ostemer Crystal clear disc and a PDMS slab for comparison purposes. The inset comprises a photograph of a PC/TPE-hybrid device (left) and a TPE device (right) demonstrating the difference in transparency.

Journal: Micromachines

Article Title: Facile Patterning of Thermoplastic Elastomers and Robust Bonding to Glass and Thermoplastics for Microfluidic Cell Culture and Organ-on-Chip

doi: 10.3390/mi12050575

Figure Lengend Snippet: ( A ) TPE microfabrication process: (i) A silicon wafer with SU-8 patterns serves as a master for (ii) the negative PDMS mold, which is replicated once more in the form of (iii) the epoxy master mold. Hot embossing using the epoxy mold enables fabrication of (iv) TPE and PC/TPE-hybrid-based microfluidic platforms. ( B ) Micrographs of features fabricated by hot embossing into TPE and PC/TPE-hybrid as well as the used photomask. A close-up side view shows microstructures in the TPE part of a PC/TPE-hybrid. The full-sized side view image of the PC/TPE-hybrid, additionally showing the transition from TPE to PC, is presented in the . Scale bar represents 200 µm. Comparison of feature dimensions between different structures, materials, and the original CAD design. The features have a height of approximately 100 µm. ( C ) UV-VIS transmittance spectra of TPE, PC, and PC/TPE-hybrid as well as of an Ostemer Crystal clear disc and a PDMS slab for comparison purposes. The inset comprises a photograph of a PC/TPE-hybrid device (left) and a TPE device (right) demonstrating the difference in transparency.

Article Snippet: The SU-8 layer was patterned by exposing the sample through the photomask to ultraviolet (UV) light (ABM Series 60 Exposure Systems; ABM, Inc., New York City, NY, USA), at 21 mW/cm2 for 5 s. The post exposure bake was performed at 65 °C for 5 min followed by a similar temperature ramp as the pre-exposure bake and then baked for an additional 9 min at 95 °C.

Techniques: Comparison